Optimization of SMT process parameter for yield improvement of PCBS

Abstract

The manufacturing process of Electronics Assembly has undergone a sea changes. Component industry has migrated to surface mounted devices from through whole components. This change has resulted into miniaturization of the equipment as well as pushed entire assembly operation to automatic process. Thus correct setting of process parameter is essential to maintain quality and throughput of the entire process. Process parameter need to be set as accurate as possible, so that there is no possibility any rejection.