OPTIMIZATION OF SHRINKAGE AND SURFACE-ROUGHNESS OF LTCC TAPE

Abstract

The Low Temperature Co-fired Ceramics (LTCC) proces s is very popular in the electronics packaging indu stry and is broadly accepted for its low cost and rapid throughput. A m ultilayer LTCC 3-D structure generally shrinks duri ng low temperature co-firing process. Shrinkage occurs in all three dimensions X , Y and Z. Shrinkage has added a challenge to get h igh performance with low temperature co-fired ceramics designs and limited t he yields of LTCC modules, components, subsystems aRoughness is the measure of texture of surface of LTCC tape and a qu antitative analysis of vertical deviation of real surface from its ideal form. This paper describes variations in X, Y and Z direc tions of LTCC tape during firing at different tempe ratures and also describes about the surface roughness of LTCC tape. Data has been con the experimental results and observa tions.