Optimization of Rectangular Microchannel Depth Under Forced Convection Heat Transfer Condition

Abstract

A numerical optimization tool is used to optimize forced convection micro-channel for minimum channel depth, channel width for high heat flux and low pressure drop. Electronic chip size of 30mm × 25mm is analyzed under forced convection heat transfer by considering rectangular channel geometry parameters with no phase transition. Channel physical parameters considered for optimization consist of channel width 300µm to 750µm, channel depth 200µm to 500µm under constant channel spacing of 500µm. The current work contains chip length of 30mm with deionized water as a working medium and 30 microchannels considered for analysis. Fully developed laminar flow is considered with constant wall temperature boundary conditions. A computer based “C” language numerical code is developed to analyze channel geometry parameters. The effects of rectangular channel dimensions on pressure drop and heat transfer rate are presented in this paper. Pressure drop observed minimum for channel width of 550µm - 750µm with channel depth of 300µm - 450µm. For constant wall temperature condition case, channel depth between 300µm - 450µm definitely seems better choice for channel width of 500µm -700µm with constant spacing of 500µm. From analysis it is reflected that, we can identify a region of possible channel configuration that can help in designing microchannel for high heat flux rate and low pressure drop which satisfy chip cooling requirement.