Abstract
In this study, Al was electrodeposited on a platinum substrate at room temperature from an ionic liquid bath of EMIC containing AlCl 3 using potentiostatic polarization (PP), galvanostatic polarization (GP), monopolar current pulse polarization (MCP) and bipolar current pulse polarization (BCP). Transition of current or potential during galvanostatic or pulse polarization revealed that the initial stage of the deposition process was controlled by a nucleation process depending on the polarization condition. For example, the average size of Al deposits decreased with increasing current density in the case of GP. FE-SEM observation showed that dense and compact Al deposits with a smooth surface were obtained by the current pulse method. Roughness factor evaluated from electrochemical impedance measurement confirmed the smooth surface of these deposits. Adhesion strength of Al deposits was greatly improved using BCP in which an anodic pulse was combined with a cathodic pulse for electrodeposition. In this study, the optimal parameters for BCP were found to be I C = −16.0 mA cm −2, I A = 1.0 mA cm −2, r C (duty ratio) = 0.5, and f = 2 Hz. The mechanisms of electrodeposition by these three methods are discussed.
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