Abstract
Liquid-assisted laser technology is used to etch defect-free materials for high-precision electronics and machinery. This study investigates water-jet-assisted laser etching of polysilicon material. The depths and widths of the etched grooves were investigated for different water-jet incident angles and velocities. To select optimal parameters for a composite etching processing, the results of many tests must be compared, and at least one set of good processing parameter combinations must be identified. Herein, the influence of different parameters on the processing results is studied using an orthogonal test method. The results demonstrate that the depths and widths of the processing grooves were nearly identical at water-jet angles of 30°and 60°; however, the 60° incidence conferred a slight advantage over 30° incidence. The section taper, section depth, and surface topography were optimized at a water-jet velocity of 24-m/s, 1.1-ms laser pulse width, 40-Hz frequency, and 180-A current. Under these conditions, the section taper and groove depth were 1.2° and 1.88 mm, respectively. The groove surfaces exhibited no splitting, slagging, or other defects, and no recast layers were visible.
Highlights
Polysilicon material is a brittle semiconductor material with high wear resistance, hardness, chemical stability, and low thermal conductivity
Zhu et al [16] established a numerical model of heat transfer and material ablation in the water-jet-assisted laser etching of single-crystal germanium
They reported that the irradiated material can be discharged through the water jet and that during the non-pulsing periods, the water-jet cooling effectively removes heat buildup in the workpiece, thereby minimizing the thermal damage caused by laser heating
Summary
Polysilicon material is a brittle semiconductor material with high wear resistance, hardness, chemical stability, and low thermal conductivity. Tangwarodomnukun et al [13,14] compared the surface morphologies of samples prepared via hybrid laser–water jet micromachining, traditional silicon processing, and laser composite processing technologies They varied the processing parameters and analyzed their effect on the heat-affected zone and processing quality. Zhu et al [16] established a numerical model of heat transfer and material ablation in the water-jet-assisted laser etching of single-crystal germanium They reported that the irradiated material can be discharged through the water jet and that during the non-pulsing periods, the water-jet cooling effectively removes heat buildup in the workpiece, thereby minimizing the thermal damage caused by laser heating. OptimalThis processing parameters the experimental grooves are velocities investigated in an orthogonal paper builds on previousinstudies by varying the jet angles and in water-jet-assisted optimization experiment. After fixing the water-jet angle at 60◦ , the optimal processing parameters in the experimental grooves orthogonal optimization experiment
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