Abstract
In the lapping/polishing is used frequently for making high precision surface finishes, and the waviness reduction in lapped/polished wafers needs to be improved. It is known that the efficiency depends on the relative friction distance between the lapping plate/polishing cloth and the wafer, and that the wafer waviness depends on the result of the deviation of relative friction distance. This study presents a method for making optimal lapping plate/polishing cloth groove rates in the radius direction for the 4-way wafer system. A genetic algorithm is used for decreasing the deviation of relative friction distance at wafer surface. The maximum deviation of relative friction distance under each calculation conditions is used for optimizing fitting function at the genetic algorithm in this paper. Simulation results show the genetic algorithm can design groove rates in a lapping plate/polishing cloth in which the deviation of relative friction distance to be remarkably small.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of the Japan Society for Precision Engineering, Contributed Papers
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
