Abstract
Micro/nanofabrication with less damage has been raised as a challenging issue in advanced micro/nanomanufacturing industries. Recently, a new hybrid laser-waterjet machining technology has been developed, in which material is removed by laser heating and softening and waterjet cooling and expelling with negligible thermal damage to the workpiece. An optimization of the process parameters, such as laser pulse energy, laser pulse overlap, focal plane position, and waterjet offset distance, in the machining of silicon using this hybrid technology is presented in this study. Grey relational analysis based on an orthogonal array is employed to optimize the multi-performance characteristics, where the groove width and heat-affected zone are minimized while the groove depth is maximized.
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