Abstract
In this paper, the result based on the techniques of indoor wood adhesive of Camellia oleifera cake and manufacturing of manmade board suggests that the most appropriate condition of preparation this adhesive is that the solid content is 50%, the reaction temperature is 50 °C, the reaction time is 40min, the dosage of PF resin prepolymer accounts for 50 percent. The pH of the reaction medium is 10 and the dosage of SDBS is 1%. The proper conditions hot pressing process of PF Camellia oleifera cake adhesive for bonding plywood are the hot pressing temperature is 120 ℃, and the hot pressing time is 0.7min/mm (42 s / mm), the gluing amount is 120g/m2, and the hot pressing pressure is 1.1MPa. The average water-resistant bonding strength of the plywood prepared under this condition is 0.79mpa, which meets the requirements of class II plate in the national standard GB / T 9846.3-2004. The emission of formaldehyde is 0.38 mg / L, which meets the requirements of class E0 plate in the national standard GB 18580-2001. What’s more, the cost is the lowest among all the techniques.
Highlights
Board making technique is a vital step in examining the performance of adhesive
Compared with commonly used urea formaldehyde resin, higher temperature is needed when pressing plywood with it. (135~140°C)this temperature is higher than that of urea formaldehyde resin for 20-30°C[3].this is because the composition of PF Camellia oleifera cake adhesive contains PF resin, protein, tannin that have reaction activity and some polymers formed by them
3.1 Preparation for PF—Camellia oleifera cake Add an appropriate amount of PF - Camellia oleifera cake adhesive into plastic containers. add30 percent Na2CO 3 aqueous solution.(solid Na2CO 3 that accounts for the whole solution ) stir the solution until it even
Summary
Board making technique is a vital step in examining the performance of adhesive. Better hot pressing technique can achieve a good quality of the product and can improve manufacturing efficiency. PF- Camellia oleifera cake adhesive has lots of advantages such as high bonding strength, good water resistance, less cost and E0 standard of formaldehyde emission. (135~140°C)this temperature is higher than that of urea formaldehyde resin for 20-30°C[3].this is because the composition of PF Camellia oleifera cake adhesive contains PF resin, protein, tannin that have reaction activity and some polymers formed by them. When these compositions need solidification, they require high activation energy[4-6].At present, there are a few studies and reports about the curing at low temperature of vegetable protein, tannin and adhesive prepared with them. We study the effect of hot pressing temperature, hot pressing time, amount of glue and hot pressing pressure on the bonding performance of adhesive
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
