Abstract
Fuel and material cost is increasing day by day in all the industries. In IC engine, engine fails mainly due insufficient of heat transfer from the cylinder wall to the atmospheric air. In SI engine, heat is extracted from the cylinder wall by convection heat transfer through the fins. In this paper optimal hole size on the fins is obtained in order to extract the heat from the engine by numerical method. ANSYS is used to find the temperature distribution on the fins , when there no holes, when there is hole diameter as 2mm, 2.5mm,3 mm, 3.5mm,3.8mm, 4mm and two row holes of 3.5 mm diameter. For this analysis fluid flow (fluent) is chosen, air is circulated on engine with 16.666 m/s velocity and with atmospheric pressure. Temperature value of 800K is applied to the cylinder wall. Temperature is compared with the all hole diameter cases, and it is found that the 3.5 mm diameter hole gives the best results compare to all other hole diameter. The temperature difference 0.04K is obtained between without holes and with 3.5 mm diameter. The 3.5 mm diameter hole fins are used where material cost goes at high rate.
Highlights
IntroductionThe IC engines fails due to thermal stresses and melting of components of engine
Fine Mesh is generated with 83627 nodes, 303865 elements ( Triangular shape) and with 3.0 mm minimum edge length for IC engine and enclosure
In the fluid flow, k-epsilon is used as fluid flow and boundary conditions are applied on ic engine and enclosure as given above data
Summary
The IC engines fails due to thermal stresses and melting of components of engine These heat source is generated due combustion of fuel, so to increase the life of the engine the liberated heat need to be extracted from the cylinder. In CI engine water is the main working fluid for extracting heat through conduction and convection process. In SI engine air is main working fluid for extracting heat through conduction ( from cylinder to fins) and convection( from fins to atmosphere air) process. In these SI engine convection is dominated on conduction process
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