Abstract

The aim of this work was to improve the processability of triglycidyl-p-aminophenol (TGPAP) epoxy resin. To achieve this improvement, a diluent, the diglycidyl ether of bisphenol F (DGEBF or BPF), was added to TGPAP, and the blended epoxy was then cured with 4, 4′-diaminodiphenyl sulfones (DDS). A response surface methodology (RSM) was used, with the target response being to achieve a blended resin with a high glass transition temperature (Tg) and maximum pot life (or processing window, PW). Characterization through dynamic mechanical thermal analysis (DMTA) and using a rheometer indicated that the optimum formulation was obtained at 55.6 wt.% of BPF and a stoichiometric ratio of 0.60. Both values were predicted to give Tg at 180 °C and a processing window of up to 136.1 min. The predicted values were verified, with the obtained Tg and processing window (PW) being 181.2 ± 0.8 °C and 140 min, respectively, which is close to the values predicted using the RSM.

Highlights

  • In a polymer matrix composite, thermosetting polymer resins are commonly used as matrices to bind reinforcements, as well as to transfer loads during service [1]

  • In the aerospace industry, multifunctional epoxy resins like triglycidyl-p-aminophenol (TGPAP) are used because they possess a high glass transition temperature (Tg), due to their ability to crosslink at higher density

  • As seen in the 3D and contour plots of surface response, Tg increases as the amount of TGPAP epoxy increases in the epoxy blend

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Summary

Introduction

In a polymer matrix composite, thermosetting polymer resins (e.g., epoxy) are commonly used as matrices to bind reinforcements, as well as to transfer loads during service [1]. These thermosetting polymers exhibit excellent chemical and corrosion resistance, as well as good mechanical strength and thermal properties [2], and are used in many diverse applications including in the automotive industries, electronics (printed circuit boards and semiconductor encapsulants), and as adhesives and composite matrices in aerospace industries [3,4].

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