Abstract
The aim of this work was to improve the processability of triglycidyl-p-aminophenol (TGPAP) epoxy resin. To achieve this improvement, a diluent, the diglycidyl ether of bisphenol F (DGEBF or BPF), was added to TGPAP, and the blended epoxy was then cured with 4, 4′-diaminodiphenyl sulfones (DDS). A response surface methodology (RSM) was used, with the target response being to achieve a blended resin with a high glass transition temperature (Tg) and maximum pot life (or processing window, PW). Characterization through dynamic mechanical thermal analysis (DMTA) and using a rheometer indicated that the optimum formulation was obtained at 55.6 wt.% of BPF and a stoichiometric ratio of 0.60. Both values were predicted to give Tg at 180 °C and a processing window of up to 136.1 min. The predicted values were verified, with the obtained Tg and processing window (PW) being 181.2 ± 0.8 °C and 140 min, respectively, which is close to the values predicted using the RSM.
Highlights
In a polymer matrix composite, thermosetting polymer resins are commonly used as matrices to bind reinforcements, as well as to transfer loads during service [1]
In the aerospace industry, multifunctional epoxy resins like triglycidyl-p-aminophenol (TGPAP) are used because they possess a high glass transition temperature (Tg), due to their ability to crosslink at higher density
As seen in the 3D and contour plots of surface response, Tg increases as the amount of TGPAP epoxy increases in the epoxy blend
Summary
In a polymer matrix composite, thermosetting polymer resins (e.g., epoxy) are commonly used as matrices to bind reinforcements, as well as to transfer loads during service [1]. These thermosetting polymers exhibit excellent chemical and corrosion resistance, as well as good mechanical strength and thermal properties [2], and are used in many diverse applications including in the automotive industries, electronics (printed circuit boards and semiconductor encapsulants), and as adhesives and composite matrices in aerospace industries [3,4].
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