Abstract
In current paper, a finned micro-channel is designed for the cooling application in Light Emitting Diode (LED), numerically using Galerkin weighted residual Finite Element Method (GFEM). Selected materials for LED-chip is GaN, Die from Si, Die-attach is made by Au-20Sn, substrate is copper and heat sink material is considered to be Al. To make a convection heat transfer for cooling process, Al2O3-water nanofluid is used as the cooling fluid flow through the micro-channel and tried to maximize the heat transfer efficiency by optimized geometry. For this aim, there geometry variables from the microchannel were selected and minimum possible geometry cases (11 cases) were proposed by Central composite design (CCD) and variables were optimized by the Response Surface Method (RSM). As a main result, parameter B, i.e. fin length had the most effect on the Nusselt number and Al2O3 nanoparticles with φ = 0.05 stated greatest heat transfer value. Also, different designs of fins arrangements, caused up to 6.5% increase in the nanofluid temperature which enhanced the LED cooling process.
Highlights
Light Emitting Diode or light-emitting diodes (LEDs) lamps have taken the place of discharge lamps such as mercury discharge lamps[1,2] and metal halide lamp[3,4] due to better energy efficiency, small size, environmental friendliness, low UV radiation, easy control and low maintenance
As described in above sections, it is tried to obtain an optimized geometry for the microchannel filled by nanofluid for LED cooling
Based on previous study in[8], the best materials for LED-chip is GaN, Die from Si, Die-attach is made by Au-20Sn, substrate is copper and heat sink material is considered to be Al
Summary
Light Emitting Diode or LED lamps have taken the place of discharge lamps such as mercury discharge lamps[1,2] and metal halide lamp[3,4] due to better energy efficiency, small size, environmental friendliness, low UV radiation, easy control and low maintenance Due to this advantages of LED lamps, many researchers focused on its improvements and optimizations. Lin et al.[12] used the nanofluid-cooled microchannel heat sink for the light-emitting diodes (LEDs) and concluded that nanofluids reduced the thermal resistance more than 42.4% where 0.5% T iO2 nanofluid improved the heat transfer efficiency up to 38.6% compared to pure water. Gholami et al.[39], Barnoon et al.[40], Toghraie et al.[41] and Arasteh et al.[42] utilized the nanofluids and investigated their behavior under different conditions for microchannel, cavity with rotating cylinders, L-shaped porous ribs in microchannel and porous heat sink, respectively
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