Abstract
Metal (Ni, Cu, Ag, Al) electrode was connected with Mg-Si-Sn based thermoelectric materials by Spark Plasma Sintering (SPS) process. Microstructure of interface, sintering process and transport properties, including elec- trical conductivity, thermal conductivity and thermal expansion coefficient, of electrode materials were investigated. The results showed that composites of Ni-Al /Al (60:40) and Cu-Al/Cu (45:55) displayed high electrical conductivity, high thermal conductivity and suitable thermal expansion coefficient to Mg-Si-Sn based materials. It is indicated that the two composites have potential to be used as good electrode materials for, and to be connected by SPS sintering to, Mg-Si-Sn based materials.
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