Optimization of Dimples in Microchannel Heat Sink with Impinging Jets — Part A: Mathematical Model and the Influence of Dimple Radius

Abstract

With increasing heat fluxes caused by electronic components, dimples have attracted wide attention by researchers and have been applied to microchannel heat sink in modern advanced cooling technologies. In this work, the combination of dimples, impinging jets and microchannel heat sink was proposed to improve the heat transfer performance on a cooling surface with a constant heat flux 500 W/cm2. A mathematical model was advanced for numerically analyzing the fluid flow and heat transfer characteristics of a microchannel heat sink with impinging jets and dimples (MHSIJD), and the velocity distribution, pressure drop, and thermal performance of MHSIJD were analyzed by varying the radii of dimples. The results showed that the combination of dimples and MHSIJ can achieve excellent heat transfer performance; for the MHSIJD model in this work, the maximum and average temperatures can be as low as 320 K and 305 K, respectively when mass flow rate is 30 g/s; when dimple radius is larger than 0.195 mm, both the heat transfer coefficient and the overall performance h/ΔP of MHSIJD are higher than those of MHSIJ.