Abstract
Selected state of the art micro scale convective heat transfer techniques are presented for use in heat sinks and heat exchangers. Hereby focus is put on optimal design aspects for micro channel components and their effect on the over-all system performance in micro-electronics cooling applications. For direct liquid cooled heat sink applications, steady and unsteady single-phase flow operation are discussed and compared with possible operating conditions for two-phase flow. Regarding compact heat exchanger applications, the effects of downscaling are discussed in terms of the penalties on hydraulic and thermal performance. Comparing the optimal design of heat sinks (minimal thermal resistance and thermal gradients as well as maximal energy recovery) and heat exchangers (maximal power density), different criteria for flow conditions and material properties emerge.
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