Abstract
The formation of stable contact layers with minimum electrical resistivity at the electrode/interconnector interface is an important task for planar SOFC stack fabrication. This work was centered on the search for optimum processing conditions of the La0.8Sr0.2MnO3±δ (LSM) based contact pastes without inorganic additives. The ball-milling conditions and contact paste composition were optimized taking into account the LSM particle size, sintering, a possibility of partial phase decomposition, and electrical conductivity of the resultant cathode contacts. Testing of the model SOFC stack with Crofer 22H interconnectors revealed sufficient adhesion, porosity, conductivity, and stability of porous LSM contact layers.
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