Optimization of a Wavy Microchannel Heat Sink with Grooves

Min-Cheol Park,Kwang-Yong Kim,Sang-Bum Ma

doi:10.3390/pr9020373

Abstract

In this study, a wavy microchannel heat sink with grooves using water as the working fluid is proposed for application to cooling microprocessors. The geometry of the heat sink was optimized to improve heat transfer and pressure loss simultaneously. To achieve optimization goals, the average friction factor and thermal resistance were used as the objective functions. Three dimensionless parameters were selected as design variables: the distance between staggered grooves, groove width, and groove depth. A modified Latin hypercube sampling (LHS) method that combines the advantages of conventional LHS and a three-level full factorial method is also proposed. Response surface approximation was used to construct surrogate models, and Pareto-optimal solutions were obtained with a multi-objective genetic algorithm. The modified LHS was proven to have better performance than the conventional LHS and full factorial methods in the present optimization problem. A representative optimal design showed that both the thermal resistance and friction factor improved by 1.55% and 3.00%, compared to a reference design, respectively.

Highlights

IntroductionMicroprocessors generate high heat flux and thermally interact with their surroundings
Microchannel Heat Sink withMicroprocessors generate high heat flux and thermally interact with their surroundings
In the wavy channel with grooves, Nu increased by about 8.34%, and Rth decreased by about 2%, but the friction factor f increased by about 1.25% in comparison with the smooth wavy channel

Summary

Introduction

Microprocessors generate high heat flux and thermally interact with their surroundings Because they are composed of many integrated components, their efficiency and performance are significantly influenced by temperature. Cooling systems are being made less noisy and smaller, and it is estimated that heat sinks capable of cooling at more than 1000 W/cm will be required in the near future [2]. Both air and water can be used for cooling systems, but as the heat generation increases with the development of microprocessors, air cooling systems have a limitation in maintaining effective cooling performance [1]. To increase air-cooling performance, the fan speed must be increased, which increases noise

Methods

Results

Conclusion