Abstract

A class of vertical 1700-V 4H-SiC superjunction (SJ) Schottky diodes have been simulated and optimized, producing results that are below the unipolar limit, while also ensuring practical and costeffective realization. A conventional vertical SJ is obtained in T-CAD software, using an n-type drift region of 9-μm and etching trenches through this region to the substrate to leave isolated mesa structures. P-columns are then created through implantation into the trench sidewalls. The charge-balanced SJ diode maximizes the breakdown voltage ( V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">BD</sub> ) and minimizes the specific ON-resistance ( R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON,SP</sub> ). However, a narrow implantation window would make the vertical structure hard to fabricate. Therefore, by introducing an angled trench sidewall ( α), 10° off vertical, a graded charge profile is introduced reducing V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">BD</sub> by 2.5% and increasing R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON,SP</sub> by 9%. However, the implantation window is widened by 20% compared with the vertical device, making the successful production of the devices more likely. To rebalance the 10° structure, a 1- μm region of increased n-type doping is introduced at the top of the n-pillar. This partially recovers the lost V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">BD</sub> and R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON, SP</sub> while maintaining an implantation window wider than the vertical SJ. The balance between R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON,SP</sub> and implantation window can be tuned depending on the doping of the 1- μm top region. The 10° structure can also be rebalanced by introducing a second 4- μm region of intermediate n-type doping, underneath the 1- μm surface region. This recovers R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON,SP</sub> , while maintaining an implantation window that is 7% wider.

Highlights

  • S iC continues to draw attention as a wide bandgap (WBG) power semiconductor due to its superior material properties and continuing maturity

  • We proposed an SiC SJ diode that was optimized to overcome some of the difficulties associated with fabrication, utilizing a trench-etch and sidewall implantation [6]. These structures revealed an improved implantation window; they required further optimization to improve the trade-off between VBD and RON,SP

  • SJ structures with a drift region thickness of 9 μm and varying sidewall angles have been compared as a guide for SiC SJ diode fabrication

Read more

Summary

INTRODUCTION

S iC continues to draw attention as a wide bandgap (WBG) power semiconductor due to its superior material properties and continuing maturity. We proposed an SiC SJ diode that was optimized to overcome some of the difficulties associated with fabrication, utilizing a trench-etch and sidewall implantation [6]. These structures revealed an improved implantation window; they required further optimization to improve the trade-off between VBD and RON,SP. Throughout the study, the traditional SJ trade-off of maximizing VBD while minimizing RON,SP is kept in balance with a realizable ion implantation window This method overcomes some of the complex fabrication challenges associated with the conventional SJ structures, and ensures practical realization of a future device

SIMULATED SiC STRUCTURES
BENCHMARKING AND SIMULATION MODELS
Determination of Charge Balance in SJ
Breakdown Mechanics
Interfacial Charge
ON-State Performance
Capacitance–Voltage Characteristics
Switching Characteristics
Benchmarking to Fabricated Devices
CONCLUSION
Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call