Abstract
Currently, 3D multi-chip stack assembly is becoming the future development direction of advanced manufacturing process for printed circuit board. However, during the process of Components stacked packages, Warpage control of chips in the reflow soldering is particularly important. By Combining Taguchi method and injection molding simulation software – Moldflow, this paper studied FBGA and PBGA warpage deformation in the POP, setted four design factors, such as the mold temperature, melt temperature, injection pressure and injection time , find out the minimum warpage combination of design and critical design factors affecting the warpage. Then the factors are ranked according to the degree of the impact of the above experiments. The best combination of levels for these factors is getted, the stacked package parameter is optimized. Experiments show that the value of warpage decreased significantly.
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