Optimization and Mechanism of SiO2-Based Slurry Components for Atomically Smooth Gallium Nitride Surface Obtained Using Chemical Mechanical Polishing Techniques

Abstract

Abstract With the ongoing progress of mobile communications and new energy technologies, the market interest in high-frequency and high-power semiconductor devices has risen. Gallium nitride (GaN), a wide bandgap semiconductor material, has become a popular area of research in relevant fields. A sufficiently flat material surface can significantly enhance the device's performance. Therefore, this paper explores the effect of oxidants on the quality of GaN surface during chemical mechanical polishing (CMP). Atomic force microscopy (AFM) was employed to examine the surface morphology of GaN after each CMP experiment. The aim was to evaluate the effect of specific slurry components on GaN surface quality. The results revealed that the introduction of oxidizers, particularly the potent oxidizer potassium persulfate (K2S2O8), was advantageous in reducing the surface roughness Sq and thus, enhancing the surface quality of GaN. The surface roughness (Sq) of GaN was reduced from 7.7 to 0.78 nm after the CMP process with the optimal components. AFM tests were conducted on different areas of the GaN surface within a range of 1 μm2, which revealed that clear images of the GaN atomic steps can be obtained, and the Sq can reach as low as 0.26 nm.