Abstract
By eliminating the influence of the substrate on parasitic thermal resistance, MEMS suspended structures become one of the accurate nanoscale thermoelectric performance evaluation devices. However, the process of MEMS suspended thermoelectric devices is complex, and its multilayer suspended structure is easy to fracture due to large stress. As a result, optimizing the design of suspended structures is critical in order to reduce manufacturing complexity and increase yield. In this study, finite element simulation is used to investigate the impacts of varying structures and sizes on the stress of MEMS suspended devices. The maximum stress and average stress of silicon nanomaterials are lowered by 90.89% and 92.35%, respectively, by optimizing the structure and size of the beams and nanobelt. Moreover, MEMS suspended devices of various structures are successfully manufactured. It not only increases the yield to more than 70% but also decreases the impact of strain on thermoelectric performance and can be used to create suspended devices with integrated silicon microstrips.
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