Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs

Abstract

Microchannel heat sinks can remove a large amount of heat in the three-dimensional integrated circuits (3-D ICs), thereby effectively solving the heat accumulation problem of chips. Despite improving the heat dissipation performance of chips, unreasonable microchannel design will increase waste and cost. In this article, a model of equivalent thermal conductivity for microchannels is constructed based on the equivalent circuit method, and the temperature response of 3-D IC can be quickly solved. Furthermore, a power adaptive microchannel (PAMC) model based on the collaborative optimization of power distribution and structural parameters is proposed. The results show that the cooling efficiency of the PAMC model is increased by 12.6% compared with the conventional model, which can effectively solve the problem of excessively high peak temperature in the layer and save more space for other circuit designs.