Abstract
A model-based optimisation of the process of printed circuit board laser structuring is presented. For this purpose, a comprehensive theoretical model of the interaction between the travelling pulsed laser beam and conductive layer, as well as between the laser beam and the induced plasma plume is employed. The model is used to calculate process speed. Based on the process speed determined, the influence of pulse power, duration, and frequency on process speed is analysed. In addition, an optimal range of process parameters with respect to process speed and quality is defined.
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