Abstract
The latest generation wafer scanners use extreme ultraviolet light to project a pattern of electronic connections onto a silicon wafer. A significant part of the projection light is absorbed by the mirrors in the projection system. This causes the mirrors to heat up and expand, which leads to a significant reduction in the imaging quality of the wafer scanner. The imaging quality can be improved by applying an additional actuation heat load to the mirrors. Because the wafer scanner can be used with a large number of different illumination settings (which lead to different load cases) and the number of thermal actuators is limited, designing an effective actuation heater layout is an important but nontrivial task. To assist this design process, this paper proposes a computational framework to optimize a small number of spatial actuation heat load shapes with their corresponding intensities for a large number of load cases. It is guaranteed that the obtained actuation heat load shapes can keep the steady-state temperature in the optical surface of the mirror sufficiently close to a desired temperature in all considered load cases. The proposed computational framework is applied to a representative three-dimensional finite element model of a mirror. The obtained actuation heat load shapes and their corresponding intensities provide insights for the design of a thermal actuation layout for mirror heating.
Published Version (
Free)
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Computer Methods in Applied Mechanics and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
