Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method

Abstract

The hybrid integrated DC/DC power modules are being used in many field, however, the operating temperature of the components becomes higher with the increasing density of the power module assembly. In this paper, orthogonal experimental design method is used to study the variation trend of DC/DC power module package thermal performance with combination of different package structure material and parameters, thus determining primary and secondary order of factor which has an influence on package heat dissipation and obtaining optimum combination of package structure parameters. The results of finite element simulation analysis shows that adopting the optimum combination of package structure parameters can decrease the chip's junction temperature.