Abstract
The jetting technology has become popular in microelectronic packaging owing to its high efficiency and the noncontact property. However, high-speed jetting will generate strong oscillation that will affect the jetting consistency. To improve the jetting consistency, the optimal jetting configuration will be designed in this paper. First, the optimal jetting structure is proposed. Then, jetting performance under the optimal design can be analyzed quantitatively and shows that the robust closure of the nozzle can be achieved under disturbance. Finally, the jetting consistency will be studied under the physics-based simulation using data collected from real jetting experiment. The simulation experiments show that the jetting consistency under the optimal design can be greatly improved.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Packaging and Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
