Abstract
The jetting technology has become popular in microelectronic packaging owing to its high efficiency and the noncontact property. However, high-speed jetting will generate strong oscillation that will affect the jetting consistency. To improve the jetting consistency, the optimal jetting configuration will be designed in this paper. First, the optimal jetting structure is proposed. Then, jetting performance under the optimal design can be analyzed quantitatively and shows that the robust closure of the nozzle can be achieved under disturbance. Finally, the jetting consistency will be studied under the physics-based simulation using data collected from real jetting experiment. The simulation experiments show that the jetting consistency under the optimal design can be greatly improved.
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More From: IEEE Transactions on Components, Packaging and Manufacturing Technology
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