Optical transceiver sub-system package based on SiOB with 8×14Gbps two-way bandwidth

Abstract

In this article a parallel optical sub-system package is designed and fabricated. An 850nm vertical cavity surface emitting laser (VCSEL) array with a laser driver are used as the light sources of the transmitter, and a photodiode (PD) array with a trans-impedance amplifier plus limiting amplifier (TIA/LA) are used as the detectors of the receiver. Two chips including VCSEL array and PD array are integrated on a high impedance silicon substrate through flip-chip process. The solder bumps are planted on substrate as input and output electrical interface. Passive alignment with high coupling efficiency and large tolerance is achieved. Electrical design for high frequency and high density package is critical, due to the issues related to Signal Integrity (SI) and Power Integrity (PI). Electrical interconnection based on substrate for highspeed signal and power integrity are also analyzed. The assembly of sub-package based on silicon substrate and PCB is finished. And an 8×14Gbps SOP parallel optical transceiver is developed. The back to back eye diagram measured results shows that bit r ate of each channel is able to reach up to 14Gbps.