Abstract
AbstractElectromigration is a microscopic phenomenon involving electric field‐induced diffusion, which is very relevant to damage in interconnects. A common method to monitor interconnect degradation is through electrical resistance measurements, which requires direct electrical contacts. It is desirable to develop non‐contact methods to monitor electromigration damage formation. Recently, we have proposed a novel Optical Microscopy Imaging Method (OMIM). Here we provide theoretical proof and additional experimental results. OMIM provides a new method for studying electromigration‐induced damage. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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