Optical interconnects by hot embossing for module and PCB technology-the EOCB approach

Abstract

The growing interest in optical interconnects at module and PCB level (printed circuit board) results from the request for higher data rates and increased performance. Using glass and polymer optical fibers together with optoelectronic components, light is introduced as a transport medium for information transfer, preventing cross-talk and electrical attenuation at high frequencies. The optical interconnection technology within these components is well developed. But in general these components are pigtailed. The result is that the systems involving electrical and optical functionality cannot be assembled by SMD processing (surface mounted devices) at board and module level. Additional pick and place steps are necessary. Here the EOCB approach (electrical optical circuit board) will provide a solution. Within the PCB an additional optical layer with waveguiding structures serves as optical interconnection wiring. That means this new carrier can inexpensively merge with current methods of commercial manufacturing equipment. In the result the assembly process will be more effective.