Optical interconnection between multilayer chips based on evanescent coupling with taper structure

Abstract

It has become an important application of microwave photonics in radar system to exchange information between radar antenna RF front-end and information processing terminals by optical interconnection technology. With the continuous improvement of radar system integration, the optical exchange between multilayer chips also faces higher challenges, especially the coupling density and position arrangement between chip waveguide themselves or between the optical fiber and chip waveguide. In this paper, a kind of integrated optical interconnection technology was proposed to help information exchange between multilayer chips based on evanescent coupling with taper structure. By the finite difference time domain (FDTD) algorithm, simulations were carried out and the results indicate that the insert loss could be restrained to 3.5 dB for the optical interconnection between different lay chips which have a gap of more than 1 micron. Besides, the optical interconnection could support high density distribution and flexible position arrangement for the optical coupling.