Abstract
We have developed a far UV spectroscopic ellipsometer system working up to 9 eV, and applied it to the characterization of three 4H-SiC samples with different surface conditions [i.e., as-received and chemical mechanical processing (CMP) processed 4H-SiC bulk substrates and a 4H-SiC epi sample]. Pseudodielectric functions ε1 and ε2 clearly demonstrate the excellent surface sensitivity of the far UV ellipsometry system as it distinguishes the improvements provided by CMP process. Simulation results of ellipsometer data indicate the existence of a damaged subsurface layer in the as-received 4H-SiC bulk substrate. The investigation of sample surfaces using atomic force microscopy confirms the results of ellipsometry measurements.
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