Abstract
Adhesive bonding technology has become one effective joining technology instead of the traditional spot-welding especially for AHSS materials. But Adhesive bond quality inspection method is limited to the mechanical performance tests such as tensile-shear test recently and it’s time-consuming and unpractical. So a reliable and practical method for on-line identifying different bond discrepancies and assessing the bond quality is necessary in industry. Based on the thermal expansion electrode displacement mechanism during weld-bonding process, the dynamic electrode displacement method could be applied for differentiating adhesive bond discrepancies effectively through acquiring and analyzing the dynamic electrode displacement signal curves during weld-bonding process from laser displacement sensors installed onto the welding gun. Lots of experiments and analysis showed that this method is basically feasible, that is, it could identify different adhesive bond discrepancies qualitatively and accurately. So it has a good potential especially applied in production line.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
