One-time deformable thermoplastic devices based on flexible circuit board technology

Abstract

This contribution describes an efficient process flow for production of one-time deformable electronic devices based on standard circuit board technology and demonstrates multiple devices fabricated using this technique. The described technology has the potential to streamline and simplify the production of complex user interfaces which typically require extensive mechanical design and many components. The employed technique allows for the production of complex 3D shapes without the need to modify existing circuit board manufacturing equipment or processes significantly. To achieve this the device is manufactured in a flat state, encapsulated in a thermoplastic polymer laminate and deformed afterwards. This allows the usage of standard electronic components in surface mount packages, which are assembled using lead-free high-temperature solder. The circuit is deformed using a high-volume cost-effective thermoforming approach, where the encapsulating polymer is heated above its glass transition temperature and forced against a mold where it is allowed to cool down again. To enable significant out-of-plane deformations stretchable meandering interconnects are used, which were traditionally developed for dynamically stretchable devices. Fabrication of the circuit starts using a standard flexible copper clad laminate which is processed using the default techniques, the resulting circuit is then attached to a carrier board coated with a reusable high-temperature pressure sensitive adhesive. The interconnect and circuit outline is then defined using laser routing or punching, cutting the flexible circuit without damaging the carrier. The residuals not part of the circuit are removed, in a process akin to protective film removal, and solder paste is stencil printed on the circuit. Afterwards components are placed using a pick-and-place machine and the boards are reflow soldered. After functional testing and repair (if necessary) the circuits are placed in a vacuum press with a thermoplastic laminate, consisting of a thermoplastic elastomer and a rigid thermoplastic sheet. During this lamination the components are protected by a highly conforming press pad. Because the adhesion between the elastomer and the circuit far exceeds that between the circuit and the carrier the circuit is released readily as the thermoplastic laminate is peeled away. The resulting laminate is built up further using thermoplastic films and sheets, and finally deformed using a vacuum forming machine. The resulting device, which is trimmed to remove the clamping edges, can then be mounted in the final assembly. The advantages of this approach are demonstrated using a series of test vehicles, demonstrating the integration of complex circuits, connectors, and power circuitry. Finally, a series of design considerations that became apparent after initial reliability testing are discussed, together with the resulting design rules.