Abstract
AbstractA one‐step electroless deposition method was developed to synthesize sponge‐like copper film with favourable mechanical adhesion on silicon substrate. X‐ray diffraction and X‐ray photoelectron spectroscopy analysis and field emission scanning electron microscopy observations indicate that the as‐prepared copper film is polycrystalline and composed of copper nanoparticles with a diameter ranging from 45 nm to 60 nm, the thickness of the film being approximately 2 μm. Hydrogen obtained through the reaction of sodium hydroxide and silicon in ethylene glycol solution was employed to reduce in situ the copper ions to form metal copper films on the silicon substrate. The electrical and mechanical properties of the as‐prepared copper film were measured. The results show that the as‐prepared copper film possesses high resistivity and low Young's modulus due to its special structure. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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