Abstract
This paper presents a novel on wafer calibration method for the measurement of radio RF passive components with R&S vector network analyzer (VNA) at RF and mm-wave frequency. This method has employed the high frequency structure simulator (HFSS) results along with multi-level optimizations to get the nominal values used for on wafer calibration. Multiline (Thru-reflect-line) TRL calibration standards fabricated on the same substrate are used with better accuracy. Measured results show that a thru line provides less than 0.015 dB insertion loss throughout the frequency range of 1GHz-67GHz. This result is much better compared to the results achieved by conventional Short-open-load-thru (SOLT) calibration and (Thru-reflect-line) TRL calibration using the available calibration substrates. Using this calibration technique, the phase variation of the thru line shows less than 3° at 67GHz which is much lower than 15° achieved by the conventional calibration methods. The measurement of the multi band characteristics of the RF passive components by simultaneous current and voltage application has also been demonstrated successfully.
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