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Abstract
This paper studies the elevated-temperature sweep characteristics of wire bond during transfer molding process for semiconductor package. A set of sweep experiments is also conducted to acquire the sweep stiffness of wire bond for several bond spans and bond heights. The results show the increase of the sweep deflections is more delicate to bond span than bond height. The main objectives of this research are to obtain elevated-temperature material properties of gold wire experimentally and to predict the wire sweep of various bond spans and bond heights subjected to drag force in the compound flow during transfer molding. Based on the analysis results of ANSYS, the effects of bond span and bond height on wire sweep in the elevated-temperature environment can be obtained. Then, the elevated-temperature deflections of wire sweep can be predicted.
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