Abstract
In this paper, we present a modeling and monitoring scheme of the friction between the wafer and polishing pad for the linear chemical-mechanical planarization (CMP) processes. Kinematic analysis of the linear CMP system is investigated and a distributed LuGre dynamic friction model is utilized to capture the friction forces generated by the wafer/pad interactions. We present an experimental validation of wafer/pad friction modeling and analysis. Pad conditioning and wafer film topography effects on the wafer/pad friction are also experimentally demonstrated. Finally, one application example is illustrated the use of friction torques for real-time monitoring the shallow trench isolation (STI) CMP processes.
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