On the use of the EMI for the health monitoring of bonded elements

Abstract

The low weight, robustness and fatigue resistance of adhesive joints make them suitable for structural joints. A fully developed nondestructive evaluation technique however is needed to monitor and assess the quality of bonded joints. In the present paper the application of the electromechanical impedance (EMI) technique is proposed. In the EMI method a piezoelectric transducer (PZT) is attached to the structure of interest. The high sensitivity and low power consumption make the EMI method feasible for real time structural health monitoring. In this study we investigated the sensitivity of the electromechanical response of a PZT to the curing and the quality of the adhesive used for bonded joints. A PXI unit running under LabView and an auxiliary circuit were employed to measure the electric impedance of a PZT glued to an aluminum plate. The system aimed at monitoring the bond line between an aluminum strip and the plate. The conductive signature of the PZT was measured and analyzed during the curing. The experimental results show that the electromechanical impedance technique is sensitive to the curing time and variations are observed for adhesives of different quality.