On the use of electrical resistivity as a measure of plastic deformation in copper

Abstract

It has been shown that, for fine-grained polycrystalline copper, the stress necessary to continue plastic deformation in tension, below ordinary recovery temperatures, can be determined by measurements of the temperature, strain rate, and residual electrical resistivity measured after a room temperature anneal. Temperature cycling experiments similar to those performed by Dorn and Orowan, some experiments on partially recovered samples, and on pretwisted samples, indicate that the tensile stress for plastic flow is a single valued function of these variables within the accuracy of the experiments.