Abstract
Methods of making reproducible thin adhesive bond layers consist either of filling a gap between two flat parallel surfaces by capillary inflow of an adhesive liquid or in squeezing a droplet of an adhesive liquid between two flat parallel surfaces. The physical quantities that are of importance in both processes are investigated. The epoxy resin considered is the Araldite CY 179 with DDSA hardener to which some BDMA catalyst is added. It is shown that the ultimate adhesive bond layer area to thickness ratio, governing the heat conduction through this layer, does not depend on the curing temperature when the capillary sucking method is applied. It is calculated that, when using the squeezing method, the squeeze force has to be larger than 100 N to obtain a larger area to thickness ratio.
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