Abstract
The role of boric acid in the copper-tin alloy bath has been investigated by means of the cathodic polarization curves, cyclic voltammograms, rate of alloy electrodeposition and morphological analysis of deposits. The results indicate that the presence of boric acid in weak acidic solution for electrodeposition of Cu−Sn alloy raises the overvoltage of hydrogen discharge and lowers the overvoltage of Cu, Sn and Cu−Sn alloy deposition on the Pt, and accelerates the rate of depostion. Boric acid was adsorbed on the surface of cathode and inhibited reduction of hydrogen, then the adsorbed boric acid promoted electrodeposition of metals as a catalyzator. However, as the concentration of boric acid is more than 0.50 mol/L, the above effect was weakened due to the complexation reaction between the excessive boric acid and metallic ions.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
