Abstract

Thin films of n-type copper doped tin sulfide (SnS:Cu) are deposited employing Chemical Spray Pyrolysis (CSP) technique and effect of post deposition annealing of the films in vacuum as well as in air is evaluated. Structural characterization through X-ray diffraction proved that annealing aided formation of polycrystalline films with orthorhombic structure and preferential orientation of grains along (111) plane, a direction greatly advantageous for PV applications. Raman spectrum of the films had two peaks (at 96cm−1 and 224cm−1) belonging only to that of SnS. The band gap of as-prepared films is around ~1.5eV which changed slightly on annealing. Surface analysis of SnS:Cu films using atomic force microscopy showed the roughness of vacuum annealed samples to be much lower than that of air annealed samples and confirming all the films to be crack free and devoid of pinholes. Chemical analyses with X-ray photoelectron spectroscopy gives the binding energies of Sn3d5/2 at 485.5eV and S2p3/2 at 161.1eV, confirming the formation of SnS with Sn2+ and S−2 state. The hot probe measurements revealed their n-type nature, which was affirmed by Hall measurements too. Appreciable hike in conductivity is obtained through Cu-doping; however annealing could not produce any notable effect on conductivity.

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