Abstract
Electrolytic corrosion of aluminium interconnection lines on low power integrated circuit chips is a critical failure mechanism during longlife applications. Theoretical analysis and experimental investigations show that the maximum allowable leak rates specified in the MIL STD 883A are insufficient for such components. A helium leak rate of 10?10 atm cm3s?1 (V 0.1 cm3, method 1014.1) should be required as well as a dry atmosphere during sealing of packages.
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