Abstract
The nucleation and growth of voids at high strain-rate is studied in copper as a model face centered cubic (fcc) material using large scale molecular dynamics (MD) methods. After a brief introduction to dynamic fracture, results are presented for the homogeneous nucleation of voids in single crystal copper and the heterogeneous nucleation in nanoscale polycrystalline copper. The simulations suggest void growth occurs through anisotropic dislocation nucleation and emission in agreement with experiment and the observed anisotropy of the tensile flow stress in fcc crystals. A phenomenological model for the transition from intergranular to transgranular fracture at high strain-rate is presented.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.