Abstract

Dielectric breakdown tests were performed on specimens prepared from BaTiO/sub 3/ material with additives (less than 10%) mainly of MgTiO/sub 3/, CaZrO/sub 3/, Bi/sub 2/O/sub 3/, and SnO/sub 2/. The dielectric constant of the specimen is about 6500 and the Curie point temperature is about 20 degrees C. The mechanism of dielectric breakdown is mainly thermal breakdown at T>T/sub c/, because breakdown stresses decrease with temperature. Breakdown occurs in the grain boundary layer at T>T/sub c/. It does not arise from thermal mechanisms or electrical mechanisms and relative to mechanical properties of low temperature and additives of specimens. >

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