Abstract
The peel test is a simple mechanical test used by microelectronics industries to measure the adhesion of thin films bonded on dielectric substrates. When the film deforms elastically during peeling, the peel force is a direct measure of the adhesive fracture energy. However, when inelastic deformation takes place, the interpretation of the experimental data is not as straightforward. A general formulation of the problem of peeling is given and solutions for metallic and polymeric films are presented. The results of the analysis reveal the effects of several parameters of the peel test, such as the mechanical properties and the thickness of the film, and provide a systematic way for the determination of the adhesive fracture energy from an experimentally measured peel force.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
