On the design and fabrication of novel lateral bipolar transistor in a deep-submicron technology

Abstract

The performance of a npn Lateral Bipolar Transistor (LBJT), based on a minimally modified submicron MOSFET without gate oxide, was studied by means of simulations and measurements on fabricated devices. Large-tilt angle, single-sided implants were successfully used to control the breakdown voltage by tailoring an asymmetric collector doping profile and providing a lightly doped region on the collector side to increase the breakdown voltage. This was accomplished by using a base/gate pedestal as the mask for the large-tilt angle, single sided implantation in a self-aligned fashion. The individual collector–base and emitter–base junctions were found to be of excellent quality but, as expected due to the lack of carrier confinement in the base of devices built on bulk silicon, the common emitter current gain was lower than one. Two options enhancing the device performance were studied using simulators: building the LBJT on Silicon-on-Insulator (SOI) or introducing SiGe into the base. The SOI device promises to provide better performance and ease of processing when compared to the SiGe base device.