Abstract
This paper presents a simple formula for thermal designing of natural-air-cooled electronic equipment casings with standard arrangement for circuit boards and power supplies. The formula meets the requirements as a practical formula, since it represents the air-cooling system in its simplified form with due regard to such factors as the stack effects, air Flow resistance, natural convective transfer and so on. The formula was applied to predict temperature rise for two practically used electronic equipment cabinets with standard arrangements and a modeling case. The predicted temperature rise values, obtained through the formula, caused very slight errors, with only 10 percent in the actual values based upon experiment results.
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