On the Anodic Oxidation of Formaldehyde during the Electroless Copper Plating Process

Abstract

The electro‐oxidation of formaldehyde at copper is examined in relation to the process of electroless plating (EP) of copper. RBS and AES analyses show that Pd catalyst migration from the deposit‐substrate to the deposit‐solution interface during the EP process is negligible. This is the case for either Cu or Ni EP deposits, and when either wet or evaporated Pd catalyst is employed. The catalytic electro‐oxidation of thus proceeds during the EP process at a copper surface with no significant coverage by any other metal atoms. It is shown that the mechanism and measured rates of electro‐oxidation at copper can be understood on the basis of recent data for relevant copper/gas systems, and some special characteristics of the copper/alkaline solution system. Detailed calculations show that , rather than , is expected to be the final product of electro‐oxidation at copper at potentials as high as +0.4V vs. RHE, provided the activation energy for recombinative hydrogen desorption from the copper surface is less than 10 kcal/mole.