Abstract

In this paper, we present the results of a combined measurement/simulation analysis of the degradation induced by on-state stress in Au-free AlGaN/gallium-nitride-on-Si Schottky barrier diodes (SBDs). Turn-on voltage ( $V_{\mathrm{ TON}}$ ) and on-resistance ( $R_{\mathrm{\scriptscriptstyle ON}}$ ) are affected by charge carrier trapping/detrapping, occurring in different regions and caused by different mechanisms, when a high stress current is applied to the device. In particular, we have investigated the degradation of SBDs adopting different stress conditions and analyzing the influence of the diode geometry; consequently, we were able to identify the physical mechanisms responsible for long-term degradation of $V_{\mathrm{ TON}}$ and $R_{\mathrm{\scriptscriptstyle ON}}$ . In addition, thanks to this approach, a critical electric field for the $R_{\mathrm{\scriptscriptstyle ON}}$ degradation has been determined.

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