On Numerical Investigation of Heat Transfer Augmentation through Pin Fin Heat Sink by Laterally Impinging Air Jet

Abstract

Computational study of heat transfer augmentation using air jet impingement is the most contemporary provocation in the micro scale and electronic packaging systems. Since the cooling of heat sink becomes the most prior and conspicuous issue, as far as the efficiency and life of the system is concerned. Hence enhancement in local heat transfer coefficient becomes a most primitive parameter in the looming world of electronic packaging system. Extensive research is carried out in the area of steady air jet impinging over the flat plate by varying geometric as well as the injection parameters. Not only that, plenty amount of research works is also available with pin fin array as the target surface. But the numerical analysis of the current problem in commercial simulating software seems to be done very less. This work is beneficial as far as the visualization of various contours; physical time and effort required in performing experiments are concerned. The present research tries to propose a valid and optimum grid size required by the current computational domain in order to obtain the results which are independent of grid size. Also an appropriate turbulence model capable of accurately predicting the realizable flow regime is being proposed. Since the heat interaction data needs to be well predicted in near wall and jet system; region simultaneously, shear stress transport model is recommended for the present computational study.